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- Compact Universal BGA Reballing Stencil for P...
제품번호 #:
228106567
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
제품번호 #:
228106567
KRW 21622
Price Details
Excluding Shipping & Custom charges ( Shipping and custom charges will be calculated on checkout )
*All items will import from 영국
0 ratings
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재고
UK 스토어에서 가져옴
지금 주문하시면 도착 예정일 수요일, 8월 05
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Universal BGA reballing stencil offers four different pitch options for precise soldering, ensuring versatility and accuracy in BGA IC chip repair.
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Shipping
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ISO 27001 Certified
What Stands Out
Compact Design
This reballing stencil's compact size facilitates easy storage and portability, making it ideal for repair technicians who require efficiency without sacrificing functionality during mobile device repairs.
High-Quality Material
Crafted from durable stainless steel, this stencil ensures long-lasting use and precision, providing technicians with reliable tools that withstand repeated use for thorough and accurate component repairs.
Universal Compatibility
Designed for various phone IC chips, this stencil provides versatility in repairs, addressing a wide range of user needs and ensuring compatibility with most popular device models on the market.
제품 세부 정보
| Item Weight | 1 lbs (450 grams) |
Who Should Buy?
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Mobile Repair Technicians
Ideal for technicians specializing in mobile repairs, needing precise stencil tools for effective BGA reballing tasks.
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DIY Electronics Enthusiasts
Great for hobbyists looking to perform advanced repairs on smartphones, enhancing their skills with professional tools.
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Small Repair Shops
Perfect for small repair shops wanting compact and efficient reballing solutions to improve workflow and service quality.
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Mass Production Facilities
Not suitable for high-volume production environments requiring automation and large-scale reballing equipment.
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Amateur Hobbyists
Not recommended for beginners who may struggle with the precision required for effective BGA reballing without experience.
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General Consumer Use
Not for everyday consumers as it requires technical skills beyond basic user capabilities for effective application.
제품 설명
Compact Universal BGA Reballing Stencil for Phone IC Chips Repair Stainless Steel
질문이 있으십니까? 채팅하기
고객 질문 및 답변
-
의문:
What pitch options does the stencil offer?
답변: The stencil offers four pitch options: 0.3mm, 0.35mm, 0.375mm, and 0.4mm. -
의문:
Is the stencil easy to transport?
답변: Yes, the compact and elegant design makes it portable and easy to use. -
의문:
What materials is the stencil made from?
답변: The stencil is made from premium stainless steel, ensuring durability and longevity.
Eminchu Templates Editorial Review
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“The product received very good packaging & safe…Thank You”
16 June 2026 · via Trustpilot
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12 June 2026 · via Trustpilot
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KRW 21622
지금 주문하시면 도착 예정일 수요일, 8월 05
This item is not restrict in my country.(Please click on above link if this item is not restrict in your country, So our team will review and allow.)
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Secured transaction
PCI DSS compliant and ISO 27001:2022 certified, with encrypted payments and full buyer protection on every order.
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Fastest cross-border delivery
특징 및 장점
- Four pitch options for versatile and accurate soldering.
- Fast and precise tin implantation without displacement.
- Elegant, compact, and portable design for easy use.
- Compatible with a variety of common IC chips.
- Crafted from durable stainless steel for long-term reliability.
- Ideal for efficient BGA IC chip repair.
Ubuy Assurance
Experience worry-free shopping with 100% original products, PCI DSS-compliant payment security, ISO 27001-certified data protection, the fastest cross-border delivery, free returns *, and secure packaging on every order.